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High Density Interconnect (HDI) PCB Solutions

  • ✔ No MOQ
  • ✔ Stable Laser Drilling & Microvia Quality
  • ✔ High-Speed & High-Density Routing Ready
  • ✔ Stacked / Staggered Via Structures Available
  • ✔ Ultra-Fine Lines | 2.5/2.5mil Capability
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Why Choose HXD's HDI PCB?

Multilayer Fabrication Capability

HXD’s HDI PCBs support multilayer structures. With advanced microvia laser drilling and precision lamination technologies, HXD enables high-density routing and reliable interconnections for complex circuit designs.

Support for Advanced Packaging

HXD supports Via-in-Pad processes, enabling direct placement of vias beneath component pads. This helps you design fin-pitch BGAs and high-density components.

Enhanced Stability

HXD supports high-precision stack-up designs. HXD micro-via technology improves board stability during thermal cycling, ensuring your products operate reliably for the long term.

Although the costs of HDI PCB  are slightly higher, it effectively reduces total layer count ,reduces board size, and improves signal performance,thereby reducing overall system and assembly costs

HXD has many years of experience in HDI PCB manufacturing and strict quality control to ensure your designs are realised smoothly from concept to mass production. Whether it’s for consumer electronics, communication devices, or high-end industrial applications, HXD can provide you with high-performance, high-reliability HDI PCB solutions.

PCB Certifications

HXD’s HDI PCBs

10 layer HDI Rigid-flex PCB

10 layer HDI Rigid-flex PCB

Advanced 10-Layer Rigid-Flex Stackup (FR4 + PI) Supports compact medical equipment designs while ensuring long-term bending reliability.

12Layer HDI with ISOLA 370HR Tg170

12Layer HDI with ISOLA 370HR Tg170

12-layer stackup with multiple HDI build-up (L1-2, L11-12) enables high-density routing, compact layouts, and advanced miniaturized designs.

Manufacturing & Processing Capabilities

Item Standard Capability Edge-limit Capability
Line width / space 1.8/1.8mil 1.5/1.5mil
Max Copper foil thickness Single layer 3oz Single layer 5oz
Min via hole size (mechanical) Min: 0.15mm Min: 0.1mm
Min blind hole size (laser) Min: 0.1mm Min: 0.05mm
Minimum semi-metallized hole Min: 0.30mm Min: 0.25mm
Buried hole 4–20 layer 30 layer
Max production board size 540mm × 620mm 540mm × 640mm
Max Aspect ratio 16:1 20:1
Line width space tolerance ±20% ±10%
PTH Aperture size tolerance ±3mil ±2mil
NPTH Aperture size ±2mil ±1.5mil
Hole location accuracy ±3mil ±2mil
Distance from hole center to hole center ±4mil ±3mil
Hole to edge precision ±3mil ±2mil
Layer to layer tolerance ±4mil ±3mil
Shape size tolerance ±100 μm ±50 μm
Impedance tolerance ±10%, Max > 50ohm ±5% ±7%, Max > 50ohm ±5%
Min. Solder Mask Dam Width (Green) 3mil 2.5mil
Min. Solder Mask Dam Width (Other colors) 4.5mil 4mil
S/M Registration ±1.5mil ±1.2mil
Min. SMT/QFP Pitch 10mil NA
Min. BGA Pitch 12mil NA
Max. Test Points / Board (Universal ET) Bed of nails: 20000
Flying probe: 1–∞		 Bed of nails: 100000
V-cut Depthing ±100 μm ±75 μm
V-cut Angle 20°, 30°, 45° NA
V-cut Precision ±100 μm ±75 μm
Warpage % General ≤ 0.75%
Module ≤ 0.50%		 General ≤ 0.50%
Module ≤ 0.30%

HDI PCB Surface Finish Capability

Multilayer Borad Thichness 2~30 Layer
Borad Thichness 0.2-4.0mm
High Density Interconnection 1+n+1, 1+1+n+1+1,2+n+2,3+n+3,4+n+4,5+n+5,Any Layer
Primary Material Supplier NANYA、ROGERS、MGC、ISOLA、SYTECH、TUC
Environmental Products ROHS、Halogen-free

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When do you need HDI PCBs?

If you face the following challenges, HDI is your solution.

Running out of space: Your enclosure is tiny, but your components are many and dense, HDI lets you make more connections in a smaller area.

Signal instability: Worried about interference during high-speed transmissions, HDI’s microvia technology effectively reduces noise and gives you a very stable signal transmission.

Need a Premium Chip: HDI can properly accommodate high-end BGAs with densely packed pins.

HDI PCB DESIGN

When designing HDI, you must break away from the traditional “through-hole-only” mindset. Below are four critical points HXD suggests:

hdi-any-layer-stackup

The Stack-up Strategy

The first step is determining the stack-up, which directly affects routing capability and manufacturing costs.

    1+N+1 (Type I): The simplest HDI, adding one laser-drilled layer on each side of the core board. Ideal for projects aming for miniaturization.

    2+N+2 (Type II): Features two laser-drilled layers (stacked or staggered). This is popular for smartphones and high-end modules.

    Any-Layer: Enables interconnection between any layers. Although it is the most expensive option, it offers maximum routing flexibility,it is the only solution for extremely high pin count BGAs.

Microvia & Via-in-Pad

Via-in-Pad: Places the via directly within the pad. This not only saves routing space but also significantly reduces inductance, improving signal quality.

Laser Via Diameter Control: Recommended diameters range from 0.1mm to 0.15mm (4 to 6 mils). For smaller vias, please contact our expert.

hdi-dfm

Design for Manufacturing(DFM)

HXD engineers want to tell you: A perfect design is useless if it can’t be built.

Keep-out zones: While laser drilling is precise, sufficient distance between holes and traces/between holes is critical to good production yield.

Stacked or Staggered Vias? Stacked saves space but demands higher plating fill process accuracy; staggered is easier to manufacture.

Our advice: Before finalizing your design, contact us to confirm which via structure best fits your project and our process capabilities.

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