Stable 4-Layer Rigid-Flex Design (FR4 + PI) Combines flexibility and rigidity to support compact layouts and dynamic bending in industrial control applications.
Rogers 4350 for RF layers + FR4 for structural layers, delivering high-frequency performance with lower material cost
Hybrid Material: FR4 Tg170 + Rogers 4350,4-Layer Rigid Structure for Broadcasting Applications,High-Precision PCB Capability
Edge-plated half holes enable module plug-in, board-to-board connection, and compact mechanical integration.
Technical Specs
Comprehensive 4-layer PCB manufacturing capabilities covering stackup design, material selection, copper thickness options, and precision fabrication for diverse applications.
| Items | Standard PCB | Advanced PCB | |
|---|---|---|---|
| 2 | Finished Board Thickness | 16~128 mil (0.4mm – 3.2mm) | / |
| 3 | Max. Panel Size | 24 × 28.5″ (622mm × 723mm) | 24 × 40″ (622mm × 1000mm) |
| 4 | Laminate Materials | FR-4, CEM-3, Mid Tg, High Tg, High CTI, Halogen Free | / |
| 5 | Finished Board Thickness Tolerance | < 1.0mm ±0.10mm (±4mil) 1.0~1.6mm ±0.15mm (±6mil) |
< 1.0mm ±0.075mm (±3mil) 1.0~1.6mm ±0.10mm (±4mil) |
| 6 | Min. Inner Thin Core Thickness | 3mil (0.075mm) | / |
| 7 | Min. Inner Line Width / Spacing | 2.5 / 3.5 mil (0.0635 / 0.089mm) | 2.5 / 2.5 mil (0.0635mm) |
| 8 | Min. Outer Line Width / Spacing | 3.5 / 3.5 mil (0.089 / 0.089mm) | 3.0 / 3.0 mil (0.075 / 0.075mm) |
| 9 | Layer-to-Layer Registration Tolerance | ±3mil (±0.075mm) | / |
| 10 | Copper Foil Thickness | 12μm, 18μm, 35μm, 70μm, 105μm, 140μm (1/3oz – 4oz) | / |
| 11 | Min. Finished Hole Size | 0.2mm | 0.15mm |
| 12 | Min. Drilling Bit Size | 0.2mm | / |
| 13 | Max. Drilling Bit Size | 6.5mm | / |
| 14 | Finished Hole Size Tolerance (PTH) | ±0.075mm (±3mil) | ±0.05mm (±2mil) |
| 15 | Finished Hole Size Tolerance (NPTH) | ±0.05mm (±2mil) | / |
| 16 | Drilling Precision Tolerance (vs CAD data) | ±0.075mm (±3mil) | ±0.05mm (±2mil) |
| 17 | PTH Hole Copper Thickness | 20–30μm | 10–15μm |
| 18 | Max. Aspect Ratio | ≤ 10:1 | 12:1 |
| 19 | Impedance Control | ±10% | ±8% |
| 20 | Min. Solder Mask Opening | 0.05mm (2mil) | 0.02mm (0.8mil) |
| 21 | Min. Solder Dam | 0.076mm (3mil) | 0.063mm (2.5mil) |
| 22 | Surface Finish | OSP, Peelable Solder Mask, Carbon Ink, HASL (lead free), ENIG, I-Ag, I-Tin | OSP, Peelable Solder Mask, Carbon Ink, HASL (lead free), ENIG, I-Ag, I-Tin |
| 23 | OSP Thickness | 0.2–0.5μm | / |
| 24 | V-Cut Angle | 20°, 30°, 45°, 60° | / |
| 25 | Min. V-Cut Co-thickness | 0.25mm | / |
| 26 | Profiling Mode | Routing & Punching | / |
| 27 | Dimensional Tolerance | ±0.10mm (4mil) | / |
| 28 | E-Test Voltage | 250 ± 5V | / |
| 29 | Max. E/T Insulation Resistance | 100 MΩ | / |
| 30 | Min. E/T Conductive Resistance | 20 MΩ | / |
In addition to 4-layer PCBs, we produce 6-layer PCB, 8-layer PCB, 10-layer PCB, and 12-layer PCB boards.These are ideal for complex and high-performance applications.
Get high-quality 4-layer PCBs with fast turnaround, competitive pricing, and no MOQ — from single prototype builds to full-scale production.
Real-World References
Real stackup configurations from HXDcircuit production orders — use these as a reference when specifying your 4-layer PCB material and surface finish.
4-layer High Frequency Hybrid Rigid PCB Stackup
| Finished Board Thickness: | 1.0+/-10%mm |
| Material: | Ro4350B(Tg>280)+IT180A |
| Surface Finish: | ENIG |
| Type: | High Frequency Hybrid Rigid PCB |
This 4-layer hybrid PCB stackup is ideal for communication PCB applications. Rogers RO4350B helps reduce signal loss and supports stable RF performance. IT180A FR-4 improves board strength and keeps the cost under control. This stackup is suitable for wireless modules, antenna boards, RF front-end circuits, routers, and base station equipment. View Product Images.
4-Layer PCB Stackup for High-Frequency Hybrid PCB + HDI
| Finished Board Thickness: | 1.2+/-10%mm |
| Application: | Advanced Radar Systems |
| Material: | Ro4350B+S1000-2 |
| Surface Finish: | ENIG |
| Special Feature: | Buried Copper Coin, Resin plugging |
This 4-layer hybrid PCB stackup is ideal for Radar PCB applications. It uses Rogers RO4350B to reduce signal loss and support stable RF signals. S1000-2M prepreg improves board strength and keeps cost under control. This stackup suits radar sensors, millimeter-wave modules, RF front-end boards, and high-frequency antenna circuits. View product images.
| Finished Board Thickness: | 1.0+/-10%mm |
| Material: | AP8535R ,TG170 |
| Surface Finish: | ENIG |
| Special Feature: | Buried Copper Coin, Resin plugging |
This 4-layer rigid-flex PCB stackup uses a double-layer flexible core between L2 and L3, with FR4 rigid sections on both sides. The thin inner copper supports better bending performance, while the plated outer copper layers provide reliable assembly and interconnection.
This structure is suitable for compact electronics, wearable devices, medical equipment, sensors, and products that need stable flex-to-rigid connections. View product images.
A 4-layer PCB is a printed circuit board with four conductive copper layers separated by insulating material. It usually includes two outer signal layers and two inner layers used for power and ground. This design offers more routing space, cleaner return paths, and improved signal integrity compared to a 2-layer board.
The standard 4 layer pcb stackup is Top Signal / GND Plane / Power Plane / Bottom Signal. It keeps signal layers on the outside, while the internal layers provide stable ground and power references.
Compared to 2-layer boards, 4-layer PCBs are widely used when products need higher circuit density, lower EMI, more stable power delivery, and better overall electrical performance.
4-Layer PCB Stackup Overview
Overview
There is no single 4-layer stackup that fits every product. Designers should choose the most suitable stackup based on specific needs, such as electrical performance, EMI control, power distribution, and routing requirements， the following stack-up are commonly used.
This is the most widely used stackup structure. It offers a perfect balance between circuit complexity, manufacturing cost, and electrical performance. It is ideal for the following applications:IoT Devices 、 Sensors、Industrial Control 、 Automotive Electronics、Consumer Electronics
This structure stops outside interference from entering the circuit. It also keeps internal signals from leaking out. It’s often used in high-speed digital designs that are very sensitive to noise. However, it also presents some design challenges.
This is a power-focused structure. If your PCB is mainly designed to drive motors or handle high-power conversion with simple control logic, this structure is perfect. It provides a more stable power supply and a cleaner grounding environment than standard stack-up.
4-layer PCBs improve electrical performance and routing flexibility while keeping production practical and cost-efficient.
In a 4-layer PCB, dedicated ground and power planes help reduce signal noise and crosstalk. This means a cleaner and more reliable signal. It’s better than single or double-sided boards.
4-layer PCBs have inner ground planes that shield against EMI. This makes them great for high-frequency and high-speed applications.
A dedicated power plane ensures stable voltage delivery across the entire board, reducing power fluctuations and improving overall circuit performance.
The additional copper layers help dissipate heat more efficiently, extending component lifespan and improving reliability in high-power applications.
4-layer PCBs meet IPC Class II and Class III standards, making them suitable for demanding industries such as automotive, aerospace, medical, and industrial equipment.
A 4-layer PCB is much more powerful than a 2-layer board, but its manufacturing cost is significantly lower than 6 or 8-layer boards. This makes it the best choice for medium-complexity circuits.
Upload your Gerber files today and our engineering team will review your design and provide a competitive quote within hours.
We support standard and custom 4-layer stackup, ensuring optimal signal integrity and EMI shielding for your specific design requirements.
From 0.4mm to 3.2mm ,we manufacture any 4-layer PCB thickness to your exact specifications — no MOQ
We offer Standard FR-4,High-Tg,Rogers,Ceramic, and Polyimide to meet all your thermal management needs.
Supports blind and buried vias, controlled impedance, via-in-pad, and back-drill techniques.
HASL Lead-Free, OSP, Immersion Silver, Immersion Tin, and Hard Gold.
Our Facility
HXD has more than 15 years of experience in multilayer PCB production. We keep investing in the latest manufacturing and inspection machines. We keep our equipment in great shape, including laser direct imaging and high-precision lamination presses. This ensures your boards are perfect every time.
FAQ
