HXDcircuit

6-Layer PCB Manufacturing

6-layer PCB manufacturing with no-MOQ, offering reliable multilayer design, stable performance, and fast delivery for industrial applications.

PCB Certifications

standard 6 layer pcb stackup

What Is a 6-Layer PCB

A 6-layer PCB is a multilayer board with four signal layers and two internal planes, usually ground and power.
The image on the left shows a standard 6-layer PCB stackup.This stackup is a balanced choice for many engineers.

It provides better EMI shielding than a 4-layer PCB. At the same time, it avoids the higher cost of 8-layer or more complex designs.

Real-World References

6-Layer PCB Stackup Examples

Real stackup configurations from HXDcircuit production orders — use these as a reference when specifying your 6-layer PCB material and surface finish.

6-Layer PCB Stackup Example 1

6 Layer PCB stackup

Finished Board Thickness: 1.6+/-2%mm
Min. Line Width / Spacing 6/6 mil
Material: FR4 Tg135
Surface Finish: Immersion Gold
Certification IPC-6012E Class II
No Imp Type Ctrl Up Ref Dn Ref Trace W Trace S IMP_Req
1 Single-ended L1 L2 7 50
2 Differential
3 Single-ended L3 L2 L4 8 50
4 Differential
5 Single-ended L4 L3 L5 8 50
6 Differential
7 Single-ended L6 L5 7 50
8 Differential

This is the most common 6-layer PCB stackup: Signal-GND-Sig-Sig-PWR-Signal. It uses ground and power planes to improve signal integrity. Inner layer routing reduces crosstalk, and the layer structure helps lower EMI. This design balances cost and high-speed performance. Click to view product images.

6-Layer PCB Stackup Example 2

Finished Board Thickness: 1.6+/-10%mm
Min. Line Width / Spacing 5/5 mil
Material: FR4 TG170
Surface Finish: Immersion Gold
Certification IPC-6012E Class II
No Imp Type Ctrl Up Ref Dn Ref Trace W Trace S IMP_Req
1 Single-ended L1 L2 7 50
2 Differential L1 L2 5.5 9.5 100
3 Single-ended L3 L2 L5 8 50
4 Differential L3 L2 L5 5.5 9.5 100
5 Single-ended L4 L2 L5 8 50
6 Differential L4 L2 L5 5.5 9.5
7 Single-ended L6 L5 7 50
8 Differential L6 L5 5.5 9.5 100

 View Product Imgaes

6-Layer PCB Stackup Example 3

6-layer-pcb-stackup-3

Finished Board Thickness: 1.41+/-10%mm
Min. Line Width / Spacing 5/5 mil
Material: FR4 TG135
Surface Finish: Immersion Gold
Certification IPC-6012E Class II
impedance information
No. type control layer ref layer orig width (Mil) orig space (Mil) adjusted width (Mil) adjusted space (Mil) required impedance value (OHM) actual impedance value (OHM)
1 single-ended L3 L2/L5 4.764 4.764 50 50.99±5
2 single-ended L4 L2/L5 4.764 4.764 50 50.99±5
3 differential L3 L2/L4 4.13 5 3.4 5.73 100 99.22±10
4 single-ended L1 L2 4.764 4.3 50 49.84±5
5 single-ended L6 L5 4.764 4.3 50 49.84±5
6 differential L1 L2 4.748 5 3.4 6.348 100 99.84±10

View Product Images

Technical Specs

6-Layer PCB Manufacturing Capabilities

HXD provides 6-layer PCB manufacturing with stackup design, material options, copper thickness, and precision production for various applications.

Items Standard PCB Advanced PCB
Finished Board Thickness 16~128 mil (0.4mm – 3.2mm) /
Max. Panel Size 24 × 28.5″ (622mm × 723mm) 24 × 40″ (622mm × 1000mm)
Laminate Materials FR-4, CEM-3, Mid Tg, High Tg, High CTI, Halogen Free /
Finished Board Thickness Tolerance < 1.0mm ±0.10mm (±4mil)
1.0~1.6mm ±0.15mm (±6mil)
< 1.0mm ±0.075mm (±3mil)
1.0~1.6mm ±0.10mm (±4mil)
Min. Inner Thin Core Thickness 3mil (0.075mm) /
Min. Inner Line Width / Spacing 2.5 / 3.5 mil (0.0635 / 0.089mm) 2.5 / 2.5 mil (0.0635mm)
Min. Outer Line Width / Spacing 3.5 / 3.5 mil (0.089 / 0.089mm) 3.0 / 3.0 mil (0.075 / 0.075mm)
Copper Foil Thickness 12μm, 18μm, 35μm, 70μm, 105μm, 140μm (1/3oz – 4oz) /
Min. Finished Hole Size 0.2mm 0.15mm
Min. Drilling Bit Size 0.2mm /
Max. Drilling Bit Size 6.5mm /
PTH Hole Copper Thickness 20–30μm 10–15μm
Max. Aspect Ratio ≤ 10:1 12:1
Min. Solder Mask Opening 0.05mm (2mil) 0.02mm (0.8mil)
Surface Finish OSP, Peelable Solder Mask, Carbon Ink, HASL (lead free), ENIG, I-Ag, I-Tin OSP, Peelable Solder Mask, Carbon Ink, HASL (lead free), ENIG, I-Ag, I-Tin
E-Test Voltage 250 ± 5V /
Max. E/T Insulation Resistance 100 MΩ /

In addition to 6-layer PCBs, we produce 8-layer PCB, 10-layer PCB, and 12-layer PCB boards.These are ideal for complex and high-performance applications.

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Ready to Build your 6-Layer PCB?

No MOQ — upload your Gerber files and receive a quote in minutes. Prototype quantities ship in 24 hours. ISO 9001 certified factory, global shipping available.

Quote within 2 hours DFM review included IPC-A-600 certified

Key Benefits of 6-Layer PCB

6-layer PCBs improve electrical performance and routing flexibility while keeping production practical and cost-efficient.

Better signal integrity

Dedicated ground and power planes reduce noise and signal loss. This helps maintain clean and stable signal transmission.

Improved EMI control

More layers allow better shielding between signals. This reduces electromagnetic interference in high-speed designs.

Higher routing density

Extra layers provide more space for complex routing. Engineers can design tighter layouts without signal conflicts.

Stable power distribution

Internal power planes deliver consistent voltage across the board. This improves performance and system reliability.

Better thermal performance

More copper layers help spread heat efficiently. This supports stable operation in high-power applications.

Advanced Equipment for 6-Layer PCB Manufacturing

HXD has more than 15 years of experience in multilayer PCB production. We keep investing in the latest manufacturing and inspection machines. We keep our equipment in great shape, including laser direct imaging and high-precision lamination presses. This ensures your boards are perfect every time.

LDI Exposure

LDI Exposure

Etching

Etching

pcb-Inner-AOI

Inner AOI

Innerlayer-Laminating

Innerlayer Laminating

pcb-E-test

E-test

Automatic-Dry-Film-Laminator

Automatic Dry Film Laminator

Semi-Auto-Legend-Printing

Semi Auto Legend Printing

VCP-Plating

VCP Plating

20+
Years Manufacturing Experience
50+
Advanced Production Machines
3,000㎡
Clean-Room Production Area
ISO
9001 · UL · IPC Certified

Applications of 6-Layer PCB

Industrial control

Industrial control

Engineers use these 6-layer PCBs in PLC systems and motor controllers. They include dedicated ground planes to reduce noise and improve stability. This helps the systems run accurately in strong electromagnetic environments, such as modern smart factories.

Communication equipment

Communication equipment

Support 10GbE switches and high-speed routers with optimized impedance control. Our 6-layer stackups minimize crosstalk and signal loss, making them ideal for high-bandwidth telecommunications infrastructure.

Automotive electronics

Automotive electronics

In automotive applications, reliability is essential. 6-layer PCBs help reduce noise, manage heat, and improve system stability under vibration.

Medical devices

Medical devices

Our 6-layer PCBs are used in MRI and CT scanner interfaces. We often use Isola or Taconic materials to ensure strong signal integrity. This supports high-resolution medical imaging and accurate patient monitoring.

Frequently Asked Questions About 6-Layer PCB

What is the typical 6-layer PCB stackup?
A common stackup is Signal–GND–Signal–Signal–PWR–Signal, which improves signal integrity, reduces EMI, and ensures stable power distribution.
What is the standard thickness of a 6-layer PCB?
Standard thickness is usually 1.6mm, but it can be customized based on design and application requirements.
How do you ensure quality in 6-layer PCB production?
We use strict quality control processes, including AOI, electrical testing, and impedance verification to ensure reliable performance.
How much does a 6-layer PCB cost?
The cost of a 6-layer PCB depends on factors such as board size, material (FR4 or high Tg), copper thickness, and quantity. In general, it costs more than a 4-layer PCB but offers better performance and higher reliability for complex designs.
When should I use 6 layers instead of 4?
Use a 6-layer PCB when your design requires better EMI control, more routing space, stable power distribution, or support for high-speed signals. It is ideal for more complex and high-performance applications.

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