Handling & Storage
PTFE substrates are relatively soft and can be easily scratched or dented during handling. Place soft protective material between boards during transport.
Operators should wear lint-free gloves to avoid surface dirt. Store the material in a cool, dry, and dark environment, and use it within 40 days when possible.
Drilling
PTFE has some flexibility, which can cause burrs or hole deformation during drilling.
Use a high-speed spindle (180,000–250,000 RPM) with a low feed rate. Use phenolic or aluminum backing plates to improve drilling stability.
For micro-vias, CO₂ laser drilling provides higher accuracy.
Surface Preparation
Before hole plating, factories usually perform surface activation first.
Plasma treatment or sodium naphthalene treatment can effectively improve hole wall bonding.
Since the activated surface is time-sensitive, the following copper plating process must be completed within 4 hours.
PTH & Copper Plating
PTFE has a relatively high Z-axis thermal expansion coefficient.
At high temperatures, this creates stress on hole walls. To ensure reliability, the plated copper must have high tensile strength.
This helps reduce the risk of barrel cracking and pad lifting, and improves overall structural stability.