What is MCPCB?

Metal Core Printed Circuit Board (MCPCB), also referred to as Insulated Metal Substrate (IMS) PCB or Thermal PCB, is a specialized type of PCB that differs from traditional FR4 boards by incorporating a metal base to enhance heat dissipation. During operation, electronic components generate heat, and the metal core efficiently channels this heat away from critical areas to less sensitive regions, such as metal heat sinks or the core itself.

The most commonly used metals for MCPCB cores are aluminum, copper, and steel alloys:

• Aluminum provides excellent thermal conductivity and heat dissipation while remaining cost-effective, making it the preferred choice for standard MCPCBs.

• Copper offers superior performance in heat transfer but comes at a higher cost.

• Steel, including both regular and stainless steel, is mechanically stronger than aluminum and copper but has lower thermal conductivity.

The selection of core material depends on the specific application, taking into account thermal performance, mechanical rigidity, and cost. Considering these factors, aluminum emerges as the most practical and economical option for most MCPCB designs.

METAL CORE PCB TECHNOLOGY BENEFITS

When an application needs strong heat dissipation, Insulated Metal Substrate (IMS) technology brings a lot of real advantages.That’s why many engineers and designers choose Metal Core PCBs—they can get the following benefits that regular FR4 boards just can’t match:

• Superior heat dissipation
• Great durability of Aluminum
• Eliminate heat sinks and other voluminous hardware
• Lightweight and strength

DOUBLE SIDED

A Double Layer MCPCB (Metal Core Printed Circuit Board) is a type of metal-based PCB that features two conductive copper layers separated by a dielectric insulation layer, all built on a metal core substrate such as aluminum, copper, or steel alloy.

Compared to a Single Layer MCPCB, the double-layer design provides more routing space, higher circuit density, and better electrical performance, while still maintaining excellent thermal conductivity thanks to the metal base.

Manufacturing Challenges:

Lamination Technology: Ensuring strong adhesion between the copper layers on both sides and the aluminum base to avoid delamination.

Insulation Treatment: The dielectric layer must maintain high insulation resistance (typically withstand voltage ≥ 2 kV).

Drilling & Hole Metallization: After drilling on the aluminum base, special treatments (such as plating the hole) are required to achieve electrical connection between the two sides.