HXDcircuit

Rigid PCB Manufacturing for High-Performance Electronics

  • No MOQ
  • Rigid PCB up to 50Layers
  • HDI board with any layer
  • Special technology can be available: Half hole, Buried Copper Coin and etc
  • Wide Material Options Including High-End RF Laminates: ISOLA 370HR, Rogers 4350, F4BM255 – materials many suppliers cannot provide, with stable availability
  • IPC Class3 compliance, UL and ISO Certified

PCB Certifications

Multi-Layer Rigid PCBs

10Layer coil PCB with thick copper weight

10Layer coil PCB with thick copper weight

Designed specifically for high-power industrial applications, ensuring reliable performance under demanding conditions.

12Layer FR4 ISOLA 370HR Tg170

12Layer FR4 ISOLA 370HR Tg170

Reliable Supply of ISOLA 370HR (Tg170),Industrial-Grade 12-Layer Stack-Up,High-Precision Conductive Performance

12Layer HDI with ISOLA 370HR Tg170

12Layer HDI with ISOLA 370HR Tg170

12-layer stackup with multiple HDI build-up (L1-2, L11-12) enables high-density routing, compact layouts, and advanced miniaturized designs.

14Layer with FR4 Tg180

14Layer with FR4 Tg180

Designed for complex, high-speed broadcasting systems requiring multi-layer signal integrity and stable performance.

4Layer Rigid-flex PCB

4Layer Rigid-flex PCB

Stable 4-Layer Rigid-Flex Design (FR4 + PI) Combines flexibility and rigidity to support compact layouts and dynamic bending in industrial control applications.

4Layer Rogers4350+FR4 with Hybrid Laminating PCB

4Layer Rogers4350+FR4 with Hybrid Laminating PCB

Rogers 4350 for RF layers + FR4 for structural layers, delivering high-frequency performance with lower material cost

4layer with Half hole

4layer with Half hole

Edge-plated half holes enable module plug-in, board-to-board connection, and compact mechanical integration.

4Layer with Rogers+FR4 Hybrid Board+Copper Coin Buried

4Layer with Rogers+FR4 Hybrid Board+Copper Coin Buried

Hybrid Material: FR4 Tg170 + Rogers 4350,4-Layer Rigid Structure for Broadcasting Applications,High-Precision PCB Capability

Different Types of Rigid PCB

HXD can supply various rigid PCB types to meet the needs of different electronic applications:

Single-Sided PCB: Conductive traces are only designed on one side of the substrate. It has a simple structure and so the production process is a very mature process. Also the cost is the lowest production cost.

Double-Sided PCB: Conductive circuits are designed on both sides of the substrate. Electrical connections between layers are made through Plated Through Holes (PTH). Compared to single-sided boards, double-sided PCBs offer much higher wiring density. This allows for more components and supports more complex circuit designs.

Multilayer PCB: Multilayer PCBs consist of three or more conductive layers separated by insulating materials. These layers are interconnected using advanced via technologies, such as Through-Hole, Blind Vias. Designed for high-performance systems, we provide custom solutions including 4-layer PCBs, 8-layer PCBs, and 10-layer PCBs to meet your specific requirements.

Single&Double Sided PCBs

2Layer with IPC Class 3 requirement and custom legend color

2Layer with IPC Class 3 requirement and custom legend color

Meets the highest reliability standard for mission-critical electronics—rare for typical 2-layer boards.

1Layer with HASL LF

1Layer with HASL LF

FR4 Material with HASL LF– Cost-effective and ideal for beginner projects, quick prototyping, training, and educational use. HASL LF has excellent solderability for repeated testing and manual solder experiments.

1Layer with KB FR1

1Layer with KB FR1

FR1 Material with OSP – Cost-effective and ideal for beginner projects, quick prototyping, training, and educational use.

2 Layer 0.4mm Thin PCB with coil track

2 Layer 0.4mm Thin PCB with coil track

Provides excellent solderability and long-term corrosion resistance. Rigid board combined with FR4 stiffener for enhanced mechanical strength.

2Layer RF board with F4BM255 High-Frequency Material

2Layer RF board with F4BM255 High-Frequency Material

Meets the highest reliability standard for mission-critical electronics—rare for typical 2-layer boards.

2Layer with 0.6mm thin thickness

2Layer with 0.6mm thin thickness

Better Flexibility Than Standard Thickness – Slight bending tolerance makes it suitable for tight assembly structures.

rigid-pcb

Why Choose HXD for Rigid PCB Manufacturing?

  • Advanced Capabilities: Specialized in multi-layer PCB and HDI PCB engineering and mass production.We have a mature  PCB manufacturing process.
  • Precision Control:  Strict management of lamination, plating, and etching to meet industrial and automotive standards.
  • Engineering Support:  We offer professional DFM reviews, stack-up optimization, and precise hole-size management.
  • Proven Reliability: Our boards are trusted in automotive electronics, industrial computers, and high-reliability systems.
  • Flexible Production: From rapid prototyping to high-volume fabrication, we help you get to market faster.

Rigid PCB Fabrication Capabilities

ItemsStandard PCBAdvanced PCB
Board TypeRigid 
Number of Layers1-20 layers50 Layers
MaterialFR-4, Aluminum, Copper Base, PTFE, Ceramic, Polyimide. Special material can be offered, such as Rogers, PTFE, ISOLA, Panasonic,Learn more about the materials we use in PCB manufacturing. 
Maximum PCB Size (Dimension)1L&2L: Min. 3×3mm Max: 600×1500mm
Multilayer: Min. 5×5mm Max: 600×1400mm
 
Board Size Tolerance (Outline)Min. ±0.1mm 
Board ThicknessMin. 0.15mm Max: 5.0mm 
Board Thickness Tolerance (t≥1.0mm)±10% 
Board Thickness Tolerance (t<1.0mm)±0.1mm 
Min Trace/SpacingMin. 2/2milMin. 1.5/1.5mil
Trace Width/Spacing Tolerance±20%±10%
Finished Copper ThicknessMin. 1/3oz, Max. 12oz 
Drill Sizes (CNC)Min. 0.15mmMin. 0.1mm
Drill Sizes (Laser)Min. 0.1mmMin. 0.05mm
Hole Location Accuracy±3mil±2mil
Max. Aspect Ratio16:120:1
Min Width of Annular Ring0.15mm (6mil) 
Finished Hole Size Tolerance (CNC)PTH: ±0.075mm, NPTH: ±0.05mmPress Fit: ±0.05mm
Minimum Legend Width (Legend)0.15mm 
Legend Width to Height Ratio (Legend)1:05 
Minimum Diameter of Plated Half Holes0.4mm 
Surface FinishingHASL with lead, HASL lead-free, ENIG, OSP, Hard Gold, Immersion Silver, Immersion Tin, ENEPIG, Carbon Ink 
Solder Mask ColourGreen, Red, Yellow, Blue, White, Black, Matt Green, Matte Black, Purple, None 
SilkscreenWhite, Black, Yellow, None 
PanelizationV-cut, Jump V-cut, Routing 
TestAOI, Fly Probe Testing (Free), Ionic Test, E-test, Impedance Control 
CertificationISO9001, TS16949, ISO14001, UL, RoHS 

What is Rigid PCB?

Rigid PCB is a type of printed circuit board that cannot be bent or folded. It is the most common type of PCB in the industry. Rigid PCBs are applied in almost all mainstream electronic products, such as laptops, desktop computers, mobile phones, and televisions. The base material of rigid PCB is typically a glass fiber reinforced material. It can give PCB higher mechanical strength and allow it to operate stably in high temperatures and complex working environments.

HXD has mature manufacturing experience and a strict quality control system. Whether your project requires cost-effective single/double-sided PCBs or advanced multilayer HDI boards, we can provide a one-stop production from full-process service from DFM (Design for Manufacturability) and quickturn to mass volume mass production.

PCB Manufacturing

Ready to start your PCB project?

pload your Gerber files today and our engineering team will review your design and provide a competitive quote within hours.

Quote within 2 hours DFM review included IPC-A-600 certified

Rigid PCB Stackup

hxd-12-layer-pcb-stackup

HXD 12-Layer PCB Stack-up

Stack-up design is critical for reducing EMI and ensuring signal integrity. Our engineering team works closely with you to optimize layer counts and material combinations. We aim to provide the most cost-effective solution for mass production without compromising performance.

HXD Technical Advantages:

  • Precision Impedance Control: Using advanced lamination monitoring and high-precision etching, we control the thickness of Cores and Prepregs at the micron level. This ensures we meet impedance tolerance requirements of ±5% to ±10%.
  • Hybrid Lamination: We specialize in mixing materials like Rogers + FR4. By precisely controlling the Coefficient of Thermal Expansion (CTE) for different materials, we deliver high-frequency performance while significantly reducing your material costs.
  • Complex Interconnect Support: We provide expert stack-up designs for 10-layer and 12-layer HDI boards, fully supporting Blind and Buried Vias.

Example: 14-Layer Rigid-HDI PCB Stackup

14-layer-rigid-hdi-pcb-stackup

Finished Board Thickness: 1.6+/-10%mm
Application: Broadcasting
Layer: 14L
Special Feature: Resin Plugging
Impedance Tolerance Layer Reference Width/spacing mil(mm)
single ended impedance lines 50ohm ±10% L1, L14 L2, L13 6.0 (0.152)
differential impedance pairs 100ohm ±10% L1, L14 L2, L13 5.0 (0.127) / 9.0 (0.229)
differential impedance pairs 90ohm ±10% L1, L14 L2, L13 5.6 (0.142) / 6.4 (0.163)
single ended impedance lines 50ohm ±10% L3, L5, L10, L12 L2 + L4,
L4 + L6,
L9 + L11,
L11 + L13
4.0 (0.102)
single ended impedance lines 40ohm ±10% 5.4 (0.137)
differential impedance pairs 80ohm ±10% 4.7 (0.119) / 5.3 (0.135)
differential impedance pairs 90ohm ±10% 4.0 (0.102) / 5.0 (0.127)
differential impedance pairs 100ohm ±10% 4.0 (0.102) / 8.0 (0.203)

Example: 12-Layer Rigid PCB Stackup

hxd-12-layer-pcb-stackup

Finished Board Thickness: 1.6+/-10%mm
Application: Industry Control
Layer: 12L
Material: ISOLA 370HR
Min.Line W/S: 0.067/0.175mm
Surface Finish: ENIG
Special Feature: Resin Plugging+Impedance Control
Impedance Tolerance Layer Reference Width/Spacing (mm)
Single ended impedance lines 50Ω ±10% L1 L2 0.1
Differential impedance pairs 100Ω ±10% L1 L2 0.1/0.175
Single ended impedance lines 50Ω ±10% L3 L2/L4 0.086
Differential impedance pairs 100Ω ±10% L3 L2/L4 0.08/0.195
Single ended impedance lines 50Ω ±10% L5 L4/L6 0.07
Differential impedance pairs 100Ω ±10% L5 L4/L6 0.067/0.2
Single ended impedance lines 50Ω ±10% L8 L9/L7 0.086
Differential impedance pairs 100Ω ±10% L8 L9/L7 0.067/0.2
Single ended impedance lines 50Ω ±10% L10 L9/L11 0.086
Differential impedance pairs 100Ω ±10% L10 L9/L11 0.08/0.195
Single ended impedance lines 50Ω ±10% L12 L11 0.1
Differential impedance pairs 100Ω ±10% L12 L11 0.1/0.175

Rigid PCB Frequently Asked Questions

Can HXD handle controlled impedance boards?

Yes — we support controlled impedance, high layer count, and advanced trace/spacing requirements.

What is the lead time for rigid PCB manufacturing?

Lead time depends on complexity and layer count, but we offer competitive quick-turn options to help keep your schedule tight.Typical prototyping can be completed within 5–7 days, while small to medium volume production usually takes 10–15 days. Expedited services are available for urgent orders.

How do you ensure the quality of rigid PCBs?

Our rigid PCBs undergo 100% electrical testing (E-test), AOI (Automated Optical Inspection), and X-Ray inspection. All products comply with IPC Class 2/3 standards and are manufactured in ISO9001 certified facilities.

Do you offer custom rigid PCB solutions?

Absolutely. We provide custom PCB design and manufacturing services, including multilayer boards, HDI, advanced copper thickness, controlled impedance, and specialized finishes according to your project requirements.

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