3-Layer PCB Stackup design
| Layer Count | 3 |
| Flex Layer Count | 1 |
| Rigid Layer Count | 2 |
| Flex Substrates | Standard Adhesive Flex Material |
| Stucture | Internal flex layer configuration, featuring a step structure with L2 gold fingers exposed and additional stiffeners for reinforcement. |
![]() |
| Layer Count | 3 |
| Flex Layer Count | 1 |
| Rigid Layer Count | 2 |
| Flex Substrates | Standard Adhesive Flex Material |
| Stucture | External flex layer configuration with added stiffener. |
![]() |
| Layer Count | 3 |
| Flex Layer Count | 1 |
| Rigid Layer Count | 2 |
| Flex Substrates | Standard Adhesive Flex Material |
| Stucture | Flex layer on the outer layer |
![]() |
4-Layer PCB Stackup design
| Layer Count | 4 |
| Flex Layer Count | 2 |
| Rigid Layer Count | 2 |
| Flex Substrates | Standard Adhesive Flex Material |
| Stucture | Flex layer on the outer layer, with vias in the flexible section. |
![]() |
| Layer Count | 4 |
| Flex Layer Count | 2 |
| Rigid Layer Count | 2 |
| Flex Substrates | Standard Adhesive Flex Material |
| Stucture | Flex layer in the inner layer. |
![]() |
| Layer Count | 4 |
| Flex Layer Count | 2 |
| Rigid Layer Count | 2 |
| Flex Substrates | Standard Adhesive Flex Material |
| Stucture | Internal flex layer with blind via technology |
![]() |
5-Layer PCB Stackup design
| Layer Count | 5 |
| Flex Layer Count | 3 |
| Rigid Layer Count | 2 |
| Flex Substrates | Standard Adhesive Flex Material |
| Stucture | Flex layer in the inner layer, with differential impedance control on the flex section. |





