3Layer Flex PCB
Board Type
Flex
Layer Packaging
3L
Material Period
PI
Board Thickness
0.2mm
Finish Cu. Weight
1/H/1 OZ
Surface Finish
ENIG
Min.Line Width/Spacing
4/4mil
Function Test
E-test
Application
Display connector
Certificated
ISO9001 ISO14001
Product Detail
3-Layer Construction with ENIG Finish
Ensures reliable signal transmission and good solderability for multi-layer flex circuits.
1/H/1 oz Copper Build Provides balanced conductivity and mechanical stability for connector circuits.
Quick Turn Prototypes Available
Supports fast sample delivery for development and testing needs.