12Layer with FR4 ISOLA 370HR Tg170
Board Type
Rigid HDI
Layer Packaging
12L
Material Period
FR4 ISOLA 370HR Tg170
Board Thickness
1.6mm
Finish Cu. Weight
1/0.5/0.5/1 OZ
Surface Finish
ENIG
Min.Line Width/Spacing
3.5/3.5mil
Function Test
E-test
Application
Communication
Special Technology
HDI (L1-2,2-11,11-12) Via in Pad Resin Plugging
Certificated
ISO9001 ISO14001 UL
Product Detail
Complex HDI Structure-12-layer stackup with multiple HDI build-up (L1-2, L11-12) enables high-density routing, compact layouts, and advanced miniaturized designs.
Fine Line Capability (3.5/3.5 mil)-Supports dense tracks in limited space, ideal for digital mixed designs.
High-Tg ISOLA 370HR Material-Provides excellent thermal reliability, low CTE, and superior mechanical strength, ideal for high-speed and high-temperature environments.