2Layer RF board with F4BM255 High-Frequency Material
Board Type
Rigid
Layer Packaging
2L
Material Period
F4BM255
Board Thickness
1.6mm
Finish Cu. Weight
1/1 OZ
Surface Finish
ENIG
Min.Line Width/Spacing
20/20mil
Function Test
E-test
Special Technology
F4BM255
Application
Broadcasting
Certificated
ISO9001 ISO14001 UL
Product Detail
Special F4BM255 High-Frequency Material
Designed for RF and microwave performance, ideal for broadcasting applications where low loss and stability are critical.
Reliable 2-Layer Rigid Structure
1.6 mm thickness with ENIG finish and 1/1 oz copper, ensuring consistent signal transmission and durability.
Stable Large-Pitch Routing
20/20 mil line/space, suitable for high-power RF layouts and robust impedance performance.