1Layer with KB FR1
FR1 Material with OSP – Cost-effective and ideal for beginner projects, quick prototyping, training, and educational use.
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1Layer with HASL LF
FR4 Material with HASL LF– Cost-effective and ideal for beginner projects, quick prototyping, training, and educational use. HASL LF has excellent solderability for repeated testing and manual solder experiments.
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2Layer with 0.6mm thin thickness
Better Flexibility Than Standard Thickness – Slight bending tolerance makes it suitable for tight assembly structures.
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1Layer Immersion Silver with High Frequency Board
Made with WL-CT350, delivering stable dielectric properties and reliable RF signal integrity for communication systems.
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4Layer Rogers4350+FR4 with Hybrid Laminating PCB
Rogers 4350 for RF layers + FR4 for structural layers, delivering high-frequency performance with lower material cost
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12Layer HDI with ISOLA 370HR Tg170
12-layer stackup with multiple HDI build-up (L1-2, L11-12) enables high-density routing, compact layouts, and advanced miniaturized designs.
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10Layer coil PCB with thick copper weight
Designed specifically for high-power industrial applications, ensuring reliable performance under demanding conditions.
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8Layer FR4 Tg170
Our hard gold fingers are plated with a thick 40μ" of gold, specifically designed to withstand thousands of mating cycles without wear, ensuring long-term reliability.
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6Layer roud PCB with long routing
Our 6-layer round PCB combines a complex circular shape with high-density 4/4mil track
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14Layer with FR4 Tg180
Designed for complex, high-speed broadcasting systems requiring multi-layer signal integrity and stable performance.
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12Layer FR4 ISOLA 370HR Tg170
Reliable Supply of ISOLA 370HR (Tg170),Industrial-Grade 12-Layer Stack-Up,High-Precision Conductive Performance
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4layer with Half hole
Edge-plated half holes enable module plug-in, board-to-board connection, and compact mechanical integration.
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