14Layer with FR4 Tg180
Board Type
Rigid
Layer Packaging
14L
Material Period
FR4 Tg180
Board Thickness
2.2mm
Finish Cu. Weight
1/H/H/H/H/H/H/H/H/H/H/H/H/1 OZ
Surface Finish
ENIG
Min.Line Width/Spacing
3.8/3.8mil
Function Test
E-test
Application
Broadcasting
Special Technology
Impedance Control Resin Plugging
Certificated
ISO9001 ISO14001 UL
Product Detail
High-Reliability 14-Layer StructureDesigned for complex, high-speed broadcasting systems requiring multi-layer signal integrity and stable performance.
Precision HDI-Level Manufacturing3.8/3.8 mil minimum line width/spacing supports dense routing and stable high-speed signal transmission.
Resin Plugging TechnologyEnhances reliability of via structures, prevents solder wicking, and improves high-density assembly.