4layer with Half hole
Board Type
Rigid
Layer Packaging
4L
Material Period
FR4 Tg135
Board Thickness
1.6mm
Finish Cu. Weight
1/H/H/1 OZ
Surface Finish
ENIG
Min.Line Width/Spacing
4/4mil
Function Test
E-test
Application
Indudtry Control
Special Technology
Half hole on edge
Certificated
ISO9001 ISO14001 UL
Product Detail
Premium ENIG Surface Finish
Ensures excellent solderability, long-term oxidation resistance, and reliable assembly performance.
Special Half-Hole Technology
Edge-plated half holes enable module plug-in, board-to-board connection, and compact mechanical integration.