8Layer FR4 Tg170
Board Type
Rigid
Layer Packaging
8L
Material Period
FR4 Tg170
Board Thickness
2.0mm
Finish Cu. Weight
1.5/1/1/1/1/1/1/1.5 OZ
Surface Finish
ENIG
Min.Line Width/Spacing
4/4mil
Function Test
E-test
Application
Computor
Special Technology
Hard Gold Plating on Golden Finger(Au.40U”)
Certificated
ISO9001 ISO14001 UL
Product Detail
Hard Gold plating: Our hard gold fingers are plated with a thick 40μ” of gold, specifically designed to withstand thousands of mating cycles without wear, ensuring long-term reliability.
Superior Electrical Performance: The hard gold surface provides low contact resistance and excellent conductivity, which is critical for high-speed data transmission in computing applications.