HXDcircuit

FR4 PCB Board Manufacturing

Professional FR4 PCB board fabrication built on industrial-grade PCB FR4 material — Tg130 to Tg180, 1–20 layers, from quick-turn prototype to high-volume mass production.

0.075mm

Min. Line/Space

0.15 mm

Min. Drill

±5%

Controlled Impedance

Free

DFM Review

PCB Certifications

FR4 PCB PRODUCTS

12Layer FR4 ISOLA 370HR Tg170

12Layer FR4 ISOLA 370HR Tg170

Reliable Supply of ISOLA 370HR (Tg170),Industrial-Grade 12-Layer Stack-Up,High-Precision Conductive Performance

14Layer with FR4 Tg180

14Layer with FR4 Tg180

Designed for complex, high-speed broadcasting systems requiring multi-layer signal integrity and stable performance.

4Layer Rogers4350+FR4 with Hybrid Laminating PCB

4Layer Rogers4350+FR4 with Hybrid Laminating PCB

Rogers 4350 for RF layers + FR4 for structural layers, delivering high-frequency performance with lower material cost

8Layer FR4 Tg170

8Layer FR4 Tg170

Our hard gold fingers are plated with a thick 40μ of gold, specifically designed to withstand thousands of mating cycles without wear, ensuring long-term reliability.

Technical Specs

FR4 PCB Manufacturing Capabilities

Complete production specification for standard FR4 PCB board orders. Advanced specs subject to DFM review.

Parameter Standard Advanced
Layer Count 1 – 8 Up to 20
Board Thickness 0.8 / 1.0 / 1.6 / 2.0 mm 0.4 – 3.2 mm (custom)
Copper Weight 1 oz (35 µm) 0.5 – 6 oz
Min Trace / Space 0.127 / 0.127 mm 0.075 / 0.075 mm
Min Drill (Mech.) 0.30 mm 0.20 mm
Min Laser Via 0.10 mm
Aspect Ratio 8 : 1 20 : 1
Controlled Impedance ± 10% ± 5%
Max Panel Size 457 × 610 mm 600 × 900 mm
PCB FR4 Material Tg 130 (Shengyi S1141) Tg150 / 170 / 180, HF grade
Surface Finish HASL (LF), ENIG OSP, Imm.Ag, Imm.Sn, ENEPIG, Hard Gold
Solder Mask Color Green, Blue, Red, Black, White Yellow, Matte Black, Clear, Purple
Via Type Through-hole Blind, Buried, Laser (HDI)
Via Fill Tented Resin fill + planarize + Cu cap
Special Process Cavity, back-drill, countersink, flex-rigid
Testing Flying probe, AOI ICT fixture, X-ray, TDR impedance

View more capabilities. Advanced specs subject to DFM review.Contact engineering for out-of-spec requirements.

Get a Quote

Ready to get started?

Upload your Gerber files and our engineers will confirm the right PCB FR4 material grade, stack-up, and surface finish — and send a DFM-checked quote within 2 hours. Free of charge.

Quote within 2 hours DFM review included IPC-A-600 certified

Material Data

FR4 PCB Material Comparison

All grades are based on standard IPC-4101 specifications. Select the right PCB FR4 material Tg grade for your temperature and reliability requirements.



Material Tg (°C) Td (°C) CTE-Z (ppm/°C) Dk @ 1 MHz Df @ 1 MHz Lead-Free Halogen-Free Best For
FR4 Standard
Tg 130 · IPC-4101/21
≥ 130 305 70 4.5 0.020 Marginal Consumer electronics, LED, toys
FR4 Mid-Tg
Tg 150 · IPC-4101/26
≥ 150 325 60 4.5 0.018 Option Industrial control, smart meters
FR4 High-Tg 170
Tg 170 · IPC-4101/99
≥ 170 340 50 4.4 0.016 Server boards, EV BMS, power PSU
FR4 High-Tg 180
Tg 180 · IPC-4101/129
≥ 180 355 42 4.3 0.015 5G telecom, aerospace, automotive
FR4 Halogen-Free
Tg 150 HF · IPC-4101/129
≥ 150 330 55 4.6 0.017 Medical, REACH compliant products

Material Advantages

Why Choose FR4 PCB Material?

FR4 material has become the industry standard for a reason. Here are the main reasons why engineers across different industries continue to choose FR4 epoxy boards.

Superior Thermal Stability

FR4 material has good heat resistance. Standard FR4 has a Tg of around 130°C, while High-Tg materials can reach 170–180°C. This thermal performance allows PCBs to work well with lead-free reflow soldering and helps prevent delamination and blistering during thermal cycling.

Most Cost-Effective PCB Material

FR4 PCBs have a mature raw material system and a stable global supply chain, with large-scale production from manufacturers such as Shengyi and Isola. This provides strong advantages in both cost and supply stability. As a result, FR4 is suitable not only for prototyping but also for mass production.

Flame Retardancy

FR4 material meets the UL94 V-0 standard, which means it can self-extinguish within 10 seconds in the event of a fire and does not produce dripping particles. This is very important for the safety of electronic products.

Mechanical Strength

FR4 has a tensile strength of up to 310 MPa (about 65,000 psi), which provides strong structural support for electronic components. It is not easily damaged during complex assembly processes or in harsh working environments.

Electrical Insulation

FR4 has excellent dielectric properties, with a dielectric constant (Dk) typically between 3.9 and 4.8. It can effectively isolate interference between circuit layers and ensure stable signal transmission. It is well suited for general electronic devices and consumer products operating below 1 GHz or 2 GHz.

Environmental Stability

FR4 has almost zero water absorption, which helps it maintain stable mechanical strength and electrical insulation performance in both dry and humid environments. In addition, it offers excellent dimensional stability and is not easily deformed by changes in temperature or humidity.

Common FR4 PCB Applications

The versatility of FR4 circuit boards makes them the default substrate across virtually every electronics segment.

01

Consumer Electronics

Smart home devices, wearable products, and gaming peripherals often use standard Tg130 or mid-Tg150 FR4 PCB boards. For designs that require ultra-thin profiles and fine-pitch BGA and QFN packages, a 0.8 mm board with ENIG (electroless nickel immersion gold) finish provides excellent flatness and reliable soldering performance.

02

Industrial Control

PLCs, VFD motor drives, industrial sensors, and SCADA controllers demand Tg150+ FR4 PCB material with tight impedance control and IPC Class II workmanship, able to withstand vibration and wide temperature cycling.

03

Automotive & EV

ECUs, BMS, ADAS radar, and in-cabin infotainment boards need High-Tg FR4 (Tg170/180), AEC-Q100-grade supply chain, and full traceability per IATF 16949 requirements.

04

5G & Telecom

Base station backplanes, router linecards, and optical transceiver boards utilize High-Tg (Tg170+) FR4 PCBs featuring controlled-impedance differential pairs and laser-drilled microvias to support high-speed signaling and dense connector arrays.

05

Medical Devices

Diagnostic imaging, patient monitoring, and implantable controllers require IPC Class III High-Tg FR4 PCBs with halogen-free (HF) properties, ensuring full traceability and strict compliance with RoHS and REACH standards.

06

Power Electronics

UPS, solar inverters, EV chargers, and server PSUs require heavy-copper (typically 3–6 oz) FR4 PCBs with High-Tg (Tg170+) material to handle high current density and thermal stress simultaneously.

Frequently Asked Questions

Common questions about FR4 PCB board fabrication and PCB FR4 material selection.

How many layers can an FR4 PCB board have?
HXD supports 1–20 layers as standard production. Beyond 20 layers, sequential lamination HDI is used, which combines multiple FR4 sub-stacks. For most commercial designs, 4–8 layers covers the vast majority of digital and mixed-signal applications.
What requirements must I specify when ordering an FR4 PCB?
When ordering an FR4 circuit board, provide: (1) Gerber + drill files, (2) layer count and board thickness, (3) copper weight per layer, (4) PCB FR4 material Tg grade, (5) surface finish, (6) solder mask color, (7) controlled impedance requirements (if any), and (8) IPC Class (II or III). HXD's online quote system collects all parameters automatically.
Is FR4 suitable for high-frequency PCB designs above 2 GHz?
Standard FR4 PCB material (Dk ≈ 4.5, Df ≈ 0.018) is practical up to about 1–2 GHz. Above that, dissipation loss becomes significant. For 5G sub-6 GHz or WiFi 6 designs, a hybrid stack-up combining FR4 with low-loss Rogers RO4003C or Isola I-Tera layers is recommended. HXD supports hybrid laminate fabrication. Contact our RF team for stack-up simulation.
What surface finish options are available for FR4 PCB boards?
HXD supports all major surface finishes: HASL (lead-free) — lowest cost, good for through-hole; ENIG — flat, ideal for fine-pitch BGA/QFN; OSP — RoHS-compliant organic coating; Immersion Silver — excellent RF performance; Immersion Tin — good for edge connectors; Hard Gold / ENEPIG — wire bonding, gold fingers. ENIG is the most popular choice for multilayer FR4 PCB fabrication.

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