24-Hour Prototype Turnaround
Standard 4-layer PCB protos shipped in 24 hours. 6–8 layer in 72 hours. Our dedicated fast-track line never compromises on quality for speed.
24 hr
Fastest Prototype
4–20L
Layer Count
±5%
Impedance Tolerance
0.075mm
Min Trace / Space
Multilayer PCB Products
12Layer FR4 ISOLA 370HR Tg170
Reliable Supply of ISOLA 370HR (Tg170),Industrial-Grade 12-Layer Stack-Up,High-Precision Conductive Performance
12Layer HDI with ISOLA 370HR Tg170
12-layer stackup with multiple HDI build-up (L1-2, L11-12) enables high-density routing, compact layouts, and advanced miniaturized designs.
14Layer with FR4 Tg180
Designed for complex, high-speed broadcasting systems requiring multi-layer signal integrity and stable performance.
8Layer Rigid-flex PCB with Dupont AP8535R and Arlon 49N
Advanced 8-Layer Rigid-Flex Stackup,hybrid Laminating Expertise
6Layer roud PCB with long routing
Our 6-layer round PCB combines a complex circular shape with high-density 4/4mil track
8Layer FR4 Tg170
Our hard gold fingers are plated with a thick 40μ of gold, specifically designed to withstand thousands of mating cycles without wear, ensuring long-term reliability.
4Layer with Rogers+FR4 Hybrid Board+Copper Coin Buried
Hybrid Material: FR4 Tg170 + Rogers 4350,4-Layer Rigid Structure for Broadcasting Applications,High-Precision PCB Capability
4layer with Half hole
Edge-plated half holes enable module plug-in, board-to-board connection, and compact mechanical integration.
HXD Multilayer Experience
Any PCB with 4 or More Layers Is a Multilayer PCB
With years of experience in multilayer PCB manufacturing, HXD offers full-stack production capabilities for 4, 6, 8, 10, 12, and 14-layer boards. Our advanced facilities and strict quality control ensure every board meets your exact requirements — from prototype to mass production. Trusted by engineers and procurement teams worldwide, HXD is your reliable partner for complex multilayer PCB projects.
Browse by Layer Count
4-Layer PCb
Consmer
8-Layer PCb
5G· Medical
10-Layer PCb
Server· GPU
12-Layer PCb
HDI · Automotive · High-Speed
Need 16, 20 layers or more?
Our engineers handle complex stackups on request
Technical Specs
Multilayer PCB Manufacturing Capabilities
Full spec sheet for standard production. Need tighter tolerances? Contact our engineering team for a custom process review.
| Items | Standard PCB | Advanced PCB |
|---|---|---|
| Layers Count | 2–16 layers | 18–20 layers & HDI products |
| Finished Board Thickness | 16~128 mil (0.4mm – 3.2mm) | / |
| Laminate Materials | FR-4, CEM-3, Mid Tg, High Tg, High CTI, Halogen Free | / |
| Finished Board Thickness Tolerance | < 1.0mm ±0.10mm (±4mil) 1.0~1.6mm ±0.15mm (±6mil) | < 1.0mm ±0.075mm (±3mil) 1.0~1.6mm ±0.10mm (±4mil) |
| Min. Inner Line Width / Spacing | 2.5 / 3.5 mil (0.0635 / 0.089mm) | 2.5 / 2.5 mil (0.0635mm) |
| Min. Outer Line Width / Spacing | 3.5 / 3.5 mil (0.089 / 0.089mm) | 3.0 / 3.0 mil (0.075 / 0.075mm) |
| Copper Foil Thickness | 12μm, 18μm, 35μm, 70μm, 105μm, 140μm (1/3oz – 4oz) | / |
| Min. Finished Hole Size | 0.2mm | 0.15mm |
| Finished Hole Size Tolerance (PTH) | ±0.075mm (±3mil) | ±0.05mm (±2mil) |
| Max. Aspect Ratio | ≤ 10:1 | 12:1 |
| Impedance Control | ±10% | ±8% |
| Min. Solder Mask Opening | 0.05mm (2mil) | 0.02mm (0.8mil) |
| Surface Finish | OSP, Peelable Solder Mask, Carbon Ink, HASL (lead free), ENIG, I-Ag, I-Tin | OSP, Peelable Solder Mask, Carbon Ink, HASL (lead free), ENIG, I-Ag, I-Tin |
| Max. Panel Size | 24 × 28.5″ (622mm × 723mm) | 24 × 40″ (622mm × 1000mm) |
| Dimensional Tolerance | ±0.10mm (4mil) | / |
Get a Quote
Ready to get started?
Upload your Gerber files today and our engineering team will review your design and provide a competitive quote within hours.
Quote within 2 hours
DFM review included
IPC-A-600 certified
Layer Options
Choose the Right Layer Count for Your Design
Whether you're building a compact wearable or a high-speed server module, we have the layer configuration and material expertise to match your performance requirements.
Most Popular
4-Layer PCB
Designed for consumer electronics and industrial control boards, featuring two internal copper planes for efficient power distribution and EMI shielding.
- ✓ Min trace/space: 0.10/0.10mm
- ✓ Board thickness: 0.4–3.2mm
- ✓ Impedance control available
- ✓ Lead time from 24 hours
Consumer
Industrial
6–8 Layer PCB
Ideal for communication modules, medical devices, and mid-complexity SoC designs. Supports advanced routing with dedicated signal, power, and ground planes for superior SI/PI performance.
- ✓ Min trace/space: 0.075/0.075mm
- ✓ Blind & buried vias supported
- ✓ Controlled impedance ±5%
- ✓ Halogen-free & high-Tg options
5G Modules
Medical
10–16 Layer PCB
High-speed computing, server boards, and advanced networking equipment. Supports HDI micro-vias, sequential lamination, and ultra-fine pitch BGA routing with strict signal integrity requirements.
- ✓ HDI micro-via: from 0.1mm
- ✓ Sequential lamination
- ✓ Any-layer via (ELIC)
- ✓ BGA pitch to 0.4mm
Networking
GPU Boards
18–20+ Layer PCB
Mission-critical applications in aerospace, defense, and high-frequency RF systems. Full IPC Class III certification, strict AS9100 process control, and custom custom multilayer PCB stackup design on request.
- ✓ Embedded passive / components
- ✓ Rogers / Megtron hybrid stackup
- ✓ IPC Class III, AS9100D
Aerospace
Defense
RF / mmWave
Stackup Engineering
Custom Multilayer PCB Stackup Design for Every Application
Our application engineers work with your signal integrity requirements to design an optimal stackup — from simple symmetric FR4 constructions to complex hybrid Rogers + FR4 designs with multiple lamination cycles. Every stackup is modeled in Polar Si9000 before production release.
-
Impedance-Controlled Traces
Single-ended 50Ω/75Ω and differential 90Ω/100Ω/120Ω controlled to ±5% using Polar modeling and TDR verification.
-
Sequential Lamination
Up to 4× lamination cycles for complex HDI builds with stacked or staggered micro-vias. Full inter-layer registration verification with X-ray.
-
Hybrid Material Stackup
Mix Rogers / Megtron high-speed layers with standard FR4 core to balance performance and cost in custom multilayer PCB stackup design.
-
Back-Drilling / Controlled Depth
Eliminates via stubs that cause resonance in high-speed SerDes channels. Available for 10 Gbps+ designs.
8-Layer Standard Stackup Example
L1
Signal (1 oz Cu)
Prepreg 2116 (100 µm)
L2
GND Plane (0.5 oz)
Core FR4 Tg170 (200 µm)
L3
Signal — 50Ω controlled
Prepreg 7628 (180 µm)
L4
PWR Plane (0.5 oz)
Core FR4 Tg170 (200 µm)
L5
GND Plane (0.5 oz)
Prepreg 7628 (180 µm)
L6
Signal — 100Ω diff
Core FR4 Tg170 (200 µm)
L7
GND Plane (0.5 oz)
Prepreg 2116 (100 µm)
L8
Signal (1 oz Cu)
Total thickness: ≈ 1.6mm · Impedance: 50Ω SE / 100Ω Diff
Our Advantages
Why Engineers Choose HXD for Multilayer PCBs
Over 15 years of multilayer fabrication experience, serving 1,000+ customers across 10+ countries.
Free DFM & Impedance Review
Every order receives a complimentary DFM check within 2 hours. Our engineers will flag issues before cutting panels — saving you costly respins.
HDI & Advanced Via Expertise
In-house laser drilling for micro-vias from 0.10mm. Any-layer HDI (ELIC), via-in-pad with copper fill, back-drilling for high-speed SerDes — all under one roof.
Competitive Pricing at Any Volume
No MOQ for prototypes. Volume pricing starts at 50 pcs. Instant online quote with real-time DFM screening — no sales calls needed for standard specs.
Engineer's Resource
Multilayer PCB Design Guide: Key Considerations
Critical design rules to get right before you send your Gerbers — straight from our engineering team.
01
Impedance Planning & Stackup Symmetry
Before starting routing, it is recommended to confirm the stackup with your manufacturer and verify it using Polar Si9000 (or a similar field solver). A symmetric stackup, with equal dielectric thickness above and below the center, helps reduce warpage during lamination. Copper distribution between layers can vary, but the total copper area on each layer should be balanced to maintain overall stability.
Pro Tip:
Request a controlled-impedance test coupon in the panel border. A TDR test at incoming inspection costs ~$30 and catches lamination variation before your boards ship.
02
Via Strategy: Through-hole vs. Blind/Buried vs. Micro-via
Through-hole vias are cheapest but create via stubs at high frequency (>10 Gbps) that act as transmission-line discontinuities. For SerDes channels, specify back-drilling to remove stub length. Blind and buried vias enable denser routing but add lamination cycles (+40–80% cost per cycle). Laser-drilled micro-vias (<0.15mm) are reserved for HDI designs with 0.4mm BGA pitch or below. Always fill and cap via-in-pad for flat surface mount under fine-pitch BGAs.
Cost Rule:
1 lamination cycle = ~+35% cost. 2 cycles = ~+80%. Design for the minimum required via complexity — and review with your fab before finalizing HDI structure.
03
Power Plane Splits & Return Path Continuity
Plane splits create impedance discontinuities that radiate EMI. Route high-speed signals parallel to (never crossing) power plane splits. Assign dedicated ground planes adjacent to every signal layer in the stackup — this creates a low-inductance return path and significantly reduces cross-talk. Bypass capacitors should be placed as close as possible to IC power pins, with vias directly at the capacitor pad, not daisy-chained.
EMC Tip:
Use a solid unbroken GND plane on layer 2 (directly beneath the top signal layer). A reference plane within 0.1mm of a signal layer provides ~30dB better EMI containment than one at 0.5mm.
04
Material Selection: When to Upgrade Beyond FR4
Standard FR4 (Tg 135) is suitable for most designs below 2 GHz and below 85°C operating temperature. For automotive or industrial applications that exceed 125°C, use high-Tg FR4 (Tg 170) or halogen-free alternatives. Above 5 GHz (Wi-Fi 6E, 5G mmWave, radar), FR4's loss tangent (Df ≈ 0.02) introduces unacceptable insertion loss — switch to low-loss materials like Rogers RO4350B (Df 0.0037) or Megtron 6 (Df 0.002). For cost-sensitive designs, a hybrid custom multilayer PCB stackup using Rogers only on the critical RF layers and FR4 elsewhere reduces cost by 40–60% versus all-Rogers construction.
Decision Guide:
<2 GHz → FR4 Tg135
2–6 GHz → FR4 Tg170 or Isola I-Speed ·
>6 GHz → Rogers RO4350B or Megtron 6 · mmWave
(>24 GHz) → Rogers RO3003G2 or CLTE-AT
FAQ
Frequently Asked Questions
Everything you need to know about ordering multilayer PCBs from HXD.
What is the minimum order quantity (MOQ) for multilayer PCBs?
There is no minimum order quantity for prototypes — you can order as few as 5 pieces. For production runs, volume pricing starts at 50 pcs. We offer significant discounts at 500, 1,000, and 5,000+ pieces. Request a quote for your specific quantity and layer count.
What file formats do you accept for multilayer PCB orders?
We accept Gerber RS-274X (preferred), ODB++, IPC-2581, and native files from Altium Designer, KiCad, Eagle, and Cadence. For drill files, use Excellon format. Please include a stackup drawing (PDF or Excel) specifying board thickness, dielectric materials, and copper weights per layer. Without a stackup file, we use our standard stackup and will confirm before production.
Can you manufacture Rogers / high-frequency multilayer PCBs?
es — Rogers, Taconic, Isola, and Megtron materials are all available. We specialize in hybrid stackups combining Rogers (e.g., RO4350B) for RF layers with standard FR4 cores. This approach offers the signal performance of full-Rogers at 40–60% lower cost. Provide your frequency range, Dk/Df requirements, and operating temperature range, and our material engineers will recommend the optimal configuration.