4 Layers 1.6mm 70µm Stackup
Below is our typical stackup for 4-layer, 1.6 mm, 70 µm PCB products.
Please note that this stackup is marked as variable, meaning we use different core and prepreg materials depending on stock availability. This approach allows us to offer faster delivery and lower prices, but may lead to slight variations in thickness and impedance.
If you require a specific material or a custom stackup, please use our PCB material selector and PCB stackup design tool , then contact us for a quote.
| Layer | Material/Thickness |
|---|---|
| Core | Variable FR4 |
| Outer Copper Thickness | 70µm |
| Inner Copper Thickness | 35µm |
| Prepreg | Variable |
| Total Thickness | ±1.6 mm |
Design Considerations
When designing a PCB stackup, consider the following:
- Controlled impedance for high-speed signals
- Balanced stackup to minimize warpage
- Separation between power and ground planes
- Dielectric thickness variation affecting impedance